| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate for power module which can effectively radiate heat generated from a semiconductor element, restrain crack generation in a solder layer placed against the semiconductor element even when loading a cool and heat cycle, and constitute a highly reliable power module, and a power module using this power module substrate. <P>SOLUTION: In a substrate for power module 10, a circuit layer of metal 12 is provided on one surface of a ceramic substrate 11, and a semiconductor element 3 is mounted on the circuit layer 12. Provided on one surface of the circuit layer 12 is a metal matrix composite plate 20 made of metal matrix composite materials comprising carbon materials filled with metals. The semiconductor element 3 is mounted via this metal matrix composite plate 20. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
