半導体装置及びその製造方法,申请号JP20100076592-传众专利搜索

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发明名称	半導体装置及びその製造方法
摘要
申请公布号	JP5696367(B2)	申请公布日期	2015.04.08
申请号	JP20100076592	申请日期	2010.03.30
申请人		发明人
分类号	H01L25/065;H01L21/3205;H01L21/60;H01L21/768;H01L23/522;H01L25/07;H01L25/18	主分类号	H01L25/065
代理机构		代理人
主权项
地址

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