METHOD FOR MANUFACTURING IMAGING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A method for producing an image pickup apparatus 10 includes processes of: cutting an image pickup chip substrate 30W where a plurality of light receiving sections 31 are formed on a first main face 30SA and electrode pads 32 are formed around each light receiving section 31 to fabricate a plurality of image pickup chips 30; bonding the first main face 30SA of the image pickup chips 30 to a glass wafer 20W via a transparent adhesive layer 41 as well as bonding dummy chips 30D to an outer peripheral region of the glass wafer 20W where the image pickup chips 30 are not bonded, via the adhesive layer 41 to fabricate a joined wafer 40W; filling a sealing member 42 between the image pickup chips 30 and the dummy chips 30D; machining the joined wafer 40W to thin a thickness; forming external connection electrodes 34 connected to each of the electrode pads 32 via through-hole interconnections 33, on a second main face 30SB; and cutting the joined wafer 40W.