| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing device for stacked semiconductor element having an improved manufacturing yield.SOLUTION: The manufacturing method for stacked semiconductor element includes: a quality determination stage of determining the quality of a semiconductor element 212 by inspecting it; an element preparation stage of preparing a plurality of semiconductor elements 221 which are individually separated and determined to be good; an element arrangement stage of arranging the plurality of semiconductor elements on one wafer 230; a wafer preparation stage of preparing another wafer 210 having a plurality of semiconductor elements; and a stacking stage of stacking semiconductor elements 212 and 222 by putting the one wafer 230 and the other wafer 210 close to each other such that positions of nondefectives 221 and defectives 223 among the plurality of semiconductor elements 222 held on the one wafer 230 are opposed to respective positions of nondefectives 211 and defectives 213 among the plurality of semiconductor elements 212 that the other wafer 210 have.</p> |
