发明名称 Semiconductor device and method of manufacturing
摘要 A diode comprising a reduced surface field effect trench structure, the reduced surface field effect trench structure comprising at least two trenches formed in a substrate and separated from one another by a joining region of the substrate, the joining region comprising an electrical contact and a layer of p-doped semiconductor material.
申请公布号 EP2858117(A1) 申请公布日期 2015.04.08
申请号 EP20130187183 申请日期 2013.10.02
申请人 NXP B.V. 发明人 BOETTCHER, TIM;FISCHER, JAN
分类号 H01L29/861;H01L21/329;H01L29/165;H01L29/40;H01L29/872 主分类号 H01L29/861
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