| 摘要 |
1,060,891. Semi-conductor devices. INTERNATIONAL RECTIFIER CORPORATION. April 1, 1965 [April 21, 1964], No. 13911/65. Heading H1K. A semi-conductor wafer is mounted in sliding contact with opposed planar portions of electrodes pressed against it by external clamping means. In the described arrangement, Fig. 1, a junction containing wafer is mounted between dished members 33, 31 indirectly attached via members 36, 37, 38 to opposite ends of ceramic sleeve 35. Pressure is applied to the dished members by nuts 46, 47 and insulated bolts 40, 41 which clamp together finned cooling plates 10, 11 cut from extruded stock. Clamping pressure is communicated to the wafer via bosses 20, 21 attached to the cooling plates, the contact between member 33 and the wafer being improved by an interleaf 32 of silver. |
