| 摘要 |
<p>The generation of byproducts in a buffer space is prevented even in a wafer processing apparatus using the buffer space in the present invention. For solving the subject, provided is a method for manufacturing a semiconductor device which comprises: a process of carrying a substrate into a processing chamber; a first element containing gas supply process of supplying a first element containing gas by interposing a buffer chamber of a shower head in the substrate arranged in the processing chamber; a second element containing gas supply process of supplying a second element gas containing gas by interposing the buffer chamber in the substrate; and a vent process performed between the first element containing gas supply process and a second element containing gas supply process, wherein the vent process comprises a buffer chamber venting process venting condition in the buffer chamber, and a processing chamber venting process venting condition in the processing chamber after the buffer chamber venting process.</p> |
