发明名称 ポリアミド樹脂組成物およびそれからなる成形品
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a meta-xylylene based polyamide resin based resin composition which is lighter, in which water absorption is lower, and the crystallization rate is quicker than that of a conventional meta-xylylene adipamide resin, and to provide a molding of the same. <P>SOLUTION: The polyamide resin composition includes 15-200 pts.mass of a filler (B) based on 100 pts.mass of a polyamide resin (A) in which 30-95 mol% of a diamine constituent unit originates in meta-xylylene diamine, 70-5 mol% thereof originates in para-xylylene diamine, and at least 50 mol% of a dicarboxylic acid constituent unit originates in sebacic acid. In addition, the molding comprising the same is disclosed. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5699464(B2) 申请公布日期 2015.04.08
申请号 JP20100156545 申请日期 2010.07.09
申请人 发明人
分类号 C08L77/06;C08G69/26;C08K3/00 主分类号 C08L77/06
代理机构 代理人
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