发明名称 |
CURABLE RESIN COMPOSITION, AND CURED PRODUCT, SEALING AGENT, AND OPTICAL SEMICONDUCTOR DEVICE USING SAME |
摘要 |
Provided is a curable resin composition capable of forming a cured product that excels in heat resistance, transparency, and flexibility and particularly excels in barrier properties against a corrosive gas (e.g., sulfur oxide). The curable resin composition includes a compound (U) containing an aliphatic carbon-carbon unsaturated bond and a compound (H) containing a hydrosilyl group and includes at least one of a ladder-type silsesquioxane [A1] and a ladder-type silsesquioxane [A2], where the ladder-type silsesquioxane [A1] contains an aliphatic carbon-carbon unsaturated bond and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard, and the ladder-type silsesquioxane [A2] contains a hydrosilyl group and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard. |
申请公布号 |
EP2857457(A1) |
申请公布日期 |
2015.04.08 |
申请号 |
EP20130793786 |
申请日期 |
2013.05.17 |
申请人 |
DAICEL CORPORATION |
发明人 |
KAMURO, SHIGEAKI;KUWANA, AKIHIRO;HARADA, NOBUHIKO |
分类号 |
C08L83/07;C08K5/3477;C08K5/5425;C08L83/05;C09K3/10;H01L23/29;H01L23/31;H01L33/50 |
主分类号 |
C08L83/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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