SUBSTRATE FOR LED, LED MODULE, AND LED BULB

摘要

LED substrate (100) of the present invention includes: translucent substrate body (11) in which an LED chip is disposed on a front face; and heat dissipation path (12) provided in substrate body (11) to dissipate heat generated in the LED chip. Substrate body (11) includes a through hole that penetrates through the substrate body (11) from the front face on which the LED chip is provided to a back face. Heat dissipation path (12) includes: heat transfer path section (12a) provided in the through hole; and heat dissipation pattern section (12b) provided on the back face of substrate body (11), and connected to heat transfer path section (12a). Thus, LED substrate (100) having superior heat dissipation is realized.