| 摘要 |
The present invention relates to a thermosetting resin composition for a semiconductor package, and to a prepreg and a metal foil laminate using the same, and more specifically, to a thermosetting resin composition for a semiconductor package, which can control reaction speed and secures flowability of a prepreg by using a benzoxazine resin as a hardener instead of a phenol novolac resin, thereby being used to a printed circuit board for the semiconductor package of micropattern, and to the prepreg and a metal foil laminate using the same. |
