| 摘要 |
<p>Disclosed is an ultra thin printed circuit board with excellent edge high stiffness and a method of manufacturing the same. The ultra thin printed circuit board can prevent yield deterioration due to an increase in bad substrates by previously preventing the generation of crack in an edge part without using a carrier substrate. An ultra thin printed circuit board according to the present invention includes an upper and a lower side and has a via hole which penetrates the upper and the lower side; a circuit pattern which is formed on the upper side and lower side of the core layer and the inner wall of the via hole; a stiffness reinforcing layer which covers a lateral wall of connecting the upper side of the core layer and the edge of the lower side, and upper and the lower edge; and a mask pattern which exposes part of the circuit pattern and covers the upper and the lower side of the core layer, and the upper and the lower side of the stiffness reinforcing layer. The stiffness reinforcing layer includes a seed pattern which is formed on the upper side of the core and the edge of the lower side, a polymer reinforcing pattern which is stacked on the seed pattern, and a metal reinforcing pattern which covers the upper side and the lower side of the polymer reinforcing pattern, and the lateral wall of the core layer.</p> |
