Complex passive design with special via implementation

摘要

This disclosure provides systems, methods and apparatus for vias in an integrated circuit structure such as a passive device. In one aspect, an integrated passive device includes a first conductive trace and a second conductive trace over the first conductive trace with an interlayer dielectric between a portion of the first conductive trace and the second conductive trace. One or more vias are provided within the interlayer dielectric to provide electrical connection between the first conductive trace and the second conductive trace. A width of the vias is greater than a width of at least one of the conductive traces.

主权项

1. An integrated passive device, comprising:
a substrate; a first conductive trace over the substrate; a second conductive trace over the first conductive trace; and an interlayer dielectric between a portion of the first conductive trace and the second conductive trace to electrically isolate the first conductive trace from the second conductive trace, the interlayer dielectric having a hole, the hole being at least partially filled and defining a via to provide direct electrical connection between the conductive traces, wherein a width of the hole is greater than a width of each of the conductive traces, both widths being lateral dimensions of the device.