发明名称 |
Method for forming and integrating metal gate transistors having self-aligned contacts and related structure |
摘要 |
According to one exemplary embodiment, a method for forming at least one metal gate transistor with a self-aligned source/drain contact includes forming a metal gate over a substrate. The method further includes forming a source/drain region in the substrate adjacent to the metal gate. The method also includes forming a conformal etch stop layer over the metal gate and the source/drain region. The method further includes forming a source/drain contact over the source/drain region, where the conformal etch stop layer imposes a pre-determined distance between the source/drain contact and the metal gate, thereby causing the source/drain contact to be self-aligned to the metal gate. |
申请公布号 |
US9000534(B2) |
申请公布日期 |
2015.04.07 |
申请号 |
US200912456462 |
申请日期 |
2009.06.17 |
申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Knorr Andreas H.;Johnson Frank Scott |
分类号 |
H01L29/78;H01L21/768;H01L27/06;H01L49/02;H01L21/28;H01L23/525;H01L29/66 |
主分类号 |
H01L29/78 |
代理机构 |
Farjami & Farjami LLP |
代理人 |
Farjami & Farjami LLP |
主权项 |
1. A method for forming at least a first metal gate transistor and a second metal gate transistor with a self-aligned source/drain contact, said method comprising:
forming a first metal gate and a second metal gate over a substrate; forming inner spacers adjacent each of said first metal gate and said second metal gate; forming a source/drain region in said substrate adjacent to said inner spacers, said source/drain region not situated directly beneath said inner spacers; forming outer spacers adjacent said inner spacers, said outer spacers situated directly on and making contact with said source/drain region; forming a conformal etch stop layer over said first metal gate, said second metal gate, and said source/drain region; forming a source/drain contact over said source/drain region and between portions of said conformal etch stop layer over said outer spacers, said source/drain contact having a generally uniform width determined by the space between said portions; wherein said conformal etch stop layer imposes a pre-determined distance between said source/drain contact and each of said first metal gate and said second metal gate, thereby causing said source/drain contact to be self-aligned to said first metal gate and said second metal gate; said first metal gate transistor and said second metal gate transistor being integrated with a polysilicon device situated over said substrate, said polysilicon device including a polysilicon segment having sloped sidewalls. |
地址 |
Grand Cayman KY |