Direct overmolding

摘要

Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components.

主权项

1. Curable composition comprising
a) an epoxy resin b) a filler composition comprising i) wollastonite having an average particle size (d50) from 2 to 50 μm and ii) amorphous silica and c) a polyester anhydride hardener obtained from the reaction of a dianhydride and a less equimoloar amount of a diol comprising polyethylene glycol wherein at least one of the fillers of the filler composition is surface treated with a silane and the weight ratio of amorphous silica to wollastonite is from 10:1 to 1:10.