发明名称 System and method of eliminating on-board calibration resistor for on-die termination
摘要 A system for calibrating impedance of an input/output (I/O) buffer on a semiconductor die includes: the I/O buffer; a temperature sensor on the semiconductor die; and a supply sensor on the semiconductor die. The temperature sensor is configured to acquire temperature information for calibrating the I/O buffer. The supply sensor is configured to acquire voltage information for calibrating the I/O buffer. The I/O buffer comprises: a memory component coupled to the temperature and supply sensors and configured to store the acquired temperature or voltage information; a logic component coupled to the memory component; and a driver with driver legs. The driver is coupled to the logic component. The logic component is configured to generate driver control signals representing an on/off configuration for the driver legs of the driver based at least in part on the acquired temperature information or the acquired voltage information stored in the memory component.
申请公布号 US9000800(B1) 申请公布日期 2015.04.07
申请号 US201213621655 申请日期 2012.09.17
申请人 Xilinx, Inc. 发明人 Cical Ionut C.;Cullen Edward;Bogue Ivan
分类号 H03K17/16;H03K19/00;H03K19/003;H04L25/02 主分类号 H03K17/16
代理机构 代理人 Chan Gerald
主权项 1. A system for calibrating impedance of an input/output (I/O) buffer on a semiconductor die, comprising: the I/O buffer on the semiconductor die; a temperature sensor on the semiconductor die, wherein the temperature sensor is configured to acquire temperature information for calibrating the I/O buffer; a supply sensor on the semiconductor die, wherein the supply sensor is configured to acquire voltage information for calibrating the I/O buffer; wherein the I/O buffer comprises: a memory component coupled to the temperature sensor and the supply sensor, the memory component configured to store the acquired temperature information or the acquired voltage information;a logic component coupled to the memory component; anda driver with driver legs, wherein the driver is coupled to the logic component;wherein the logic component is configured to generate driver control signals representing an on/off configuration for the driver legs of the driver of the I/O buffer based at least in part on the acquired temperature information or the acquired voltage information stored in the memory component.
地址 San Jose CA US