发明名称 Semiconductor integrated circuit, electronic device, solid-state imaging apparatus, and imaging apparatus
摘要 A semiconductor integrated circuit includes a first semiconductor substrate in which a part of an analog circuit is formed between the analog circuit and a digital circuit which subjects an analog output signal output from the analog circuit to digital conversion; a second semiconductor substrate in which the remaining part of the analog circuit and the digital circuit are formed; and a substrate connection portion which connects the first and second semiconductor substrates to each other. The substrate connection portion transmits an analog signal which is generated by a part of the analog circuit of the first semiconductor substrate to the second semiconductor substrate.
申请公布号 US9000501(B2) 申请公布日期 2015.04.07
申请号 US201113218933 申请日期 2011.08.26
申请人 Sony Corporation 发明人 Kudoh Yoshiharu
分类号 H01L31/02;H01L27/146 主分类号 H01L31/02
代理机构 Sheridan Ross P.C. 代理人 Sheridan Ross P.C.
主权项 1. An electronic device comprising: a semiconductor integrated circuit in which an analog circuit and a digital circuit which subjects an analog output signal output from the analog circuit to digital conversion coexist, wherein the semiconductor integrated circuit has (a) first and second substrates, (b) a first part of an analog signal circuit on the first substrate, the analog signal circuit generating an analog signal, the first part including at least a transfer transistor, a reset transistor, a select transistor, and an amplification transistor formed as a follower circuit, such that the drain of the amplification transistor is connected to a power supply, the source of the amplification transistor is connected to the drain of the select transistor, and a gate of the amplification transistor is connected to a row selection signal line, (c) a second part of the analog signal circuit on the second substrate, the second part having a current supply, the current supply being used as a load for the follower circuit, (d) a digital signal circuit on the second substrate, the digital circuit converting the analog signal into a digital signal, (e) a connection between the first and second substrates connecting the first and second parts of the analog signal circuit to each other, (f) a row scanning circuit on the first substrate, and (g) at least one of a timing control circuit and a scanning circuit on the second substrate, wherein the row scanning circuit overlays the at least one of the timing control circuit and the scanning circuit.
地址 JP