发明名称 Fin-type semiconductor device
摘要 An apparatus comprises a substrate and a fin-type semiconductor device extending from the substrate. The fin type semiconductor device comprises a fin that comprises a first region having a first doping concentration and a second region having a second doping concentration. The first doping concentration is greater than the second doping concentration. The fin type semiconductor device also comprises an oxide layer. Prior to source and drain formation of the fin-type semiconductor device, a doping concentration of the oxide layer is less than the first doping concentration.
申请公布号 US8999792(B2) 申请公布日期 2015.04.07
申请号 US201313834594 申请日期 2013.03.15
申请人 QUALCOMM Incorporated 发明人 Li Xia;Yang Bin;Song Stanley Seungchul
分类号 H01L21/336;H01L29/786;G06F17/50;H01L21/8234;H01L29/66;H01L29/78 主分类号 H01L21/336
代理机构 Toler Law Group, PC 代理人 Toler Law Group, PC
主权项 1. A method comprising: forming a fin that extends from a substrate, wherein forming the fin comprises implanting first ion implants into the substrate at a first depth, wherein the fin comprises a first region having a first doping concentration and a second region having a second doping concentration, wherein the first region comprises at least one of the first ion implants, and wherein the first doping concentration is greater than the second doping concentration; forming a second fin that extends from the substrate, wherein forming the second fin comprises implanting second ion implants into the substrate at a second depth different than the first depth, wherein the second fin comprises a third region having a third doping concentration and a fourth region having a fourth doping concentration, and wherein the third region comprises at least one of the first ion implants; and forming an oxide layer on the substrate, wherein prior to source and drain formation of a fin-type semiconductor device that includes the fin, a doping concentration of the oxide layer is less than the first doping concentration.
地址 San Diego CA US
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