发明名称 Solid-state imaging apparatus
摘要 The present invention relates to a solid-state imaging apparatus including a first substrate having a plurality of photoelectric conversion units and a second substrate having a plurality of readout circuits. The first substrate is provided with a plurality of first conductive patterns that are electrically separated from one another and the second substrate is provided with a plurality of second conductive patterns that are electrically separated from one another. The first conductive patterns each include a first partial pattern extending in a first direction. The second conductive patterns each include a partial pattern extending in a second direction different from the first direction. The first partial pattern has a length extending in the first direction longer than a length thereof in the second direction.
申请公布号 US9000343(B2) 申请公布日期 2015.04.07
申请号 US201113807002 申请日期 2011.06.23
申请人 Canon Kabushiki Kaisha 发明人 Ichikawa Takeshi;Shimotsusa Mineo;Momma Genzo
分类号 H01L27/146;H01L31/00 主分类号 H01L27/146
代理机构 Canon USA, Inc. IP Division 代理人 Canon USA, Inc. IP Division
主权项 1. A solid-state imaging apparatus including a first substrate on which a plurality of photoelectric conversion units are arranged and a second substrate on which a plurality of readout circuits to process or read a signal generated by each of the photoelectric conversion units are arranged, the solid-state imaging apparatus comprising: a plurality of first conductive patterns which are arranged on the first substrate and electrically separated from one another; and a plurality of second conductive patterns which are arranged on the second substrate and electrically separated from one another,wherein each of the plurality of first conductive patterns has a first electrical connection portion to be in contact with at least one of the second conductive pattern, and each of the plurality of second conductive patterns has a second electrical connection portion to be in contact with at least one of the first conductive patterns,wherein the first conductive pattern includes a first partial pattern that includes the first electrical connection portion and extends in a first direction, and the second conductive pattern includes a second partial pattern that includes the second electrical connection portion and extends in a second direction different from the first direction, andwherein the first partial pattern has a length extending in the first direction longer than a length thereof in the second direction.
地址 Tokyo JP