发明名称 EMI-preventing socket and manufacturing method thereof
摘要 A manufacturing method for an EMI-preventing socket comprises the following steps of providing an EMI-preventing element and a plurality of pins, wherein at least one of the pins is a ground pin; connecting the EMI-preventing element to the ground pin via a direct physical connection; providing a mold; placing the EMI-preventing element, the ground pin and the remaining pins of the plurality of pins in the mold, wherein the EMI-preventing element surrounds the pins in the mold; and providing a molding material into the mold to cover the plurality of pins and to cover a joint of the EMI-preventing element and the ground pin to form a socket body of the EMI-preventing socket. Parts of the EMI-preventing element and one end of each of the plurality of pins is exposed out of the socket body of the EMI-preventing socket.
申请公布号 US8997345(B2) 申请公布日期 2015.04.07
申请号 US201213355305 申请日期 2012.01.20
申请人 Delta Electronics (Shanghai) Co., Ltd.;Delta Electronics, Inc. 发明人 Liu Gang
分类号 H01R43/24;H01R13/6581 主分类号 H01R43/24
代理机构 Muncy, Geissler, Olds & Lowe, P.C. 代理人 Muncy, Geissler, Olds & Lowe, P.C.
主权项 1. A manufacturing method for an EMI-preventing socket, comprising the following steps of: providing an EMI-preventing element and a plurality of pins, wherein at least one of the pins is a ground pin; connecting the EMI-preventing element to the ground pin via a direct physical connection; providing a mold; placing the EMI-preventing element, the ground pin and the remaining pins of the plurality of pins in the mold, wherein the EMI-preventing element surrounds the pins in the mold; and providing a molding material into the mold to cover the plurality of pins and to cover a joint of the EMI-preventing element and the ground pin to form a socket body of the EMI-preventing socket, wherein parts of the EMI-preventing element and one end of each of the plurality of pins is exposed out of the socket body of the EMI-preventing socket.
地址 Shanghai CN