Method for manufacturing a device on a substrate

摘要

A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure, forming a planarization layer on the auxiliary layer and on the substrate, exposing the auxiliary layer by a chemical mechanical polishing process and removing at least partly the auxiliary layer to form a planar surface of the remaining auxiliary layer or of the layer structure and the planarization layer. The chemical mechanical polishing process has a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer and the first removal rate is greater than the second removal rate.

主权项

1. A method for manufacturing a device on a substrate, the method comprising:
forming a layer structure on the substrate; forming an auxiliary layer on the layer structure; forming a planarization layer on the auxiliary layer and on the substrate; exposing the auxiliary layer and the planarization layer to a chemical mechanical polishing process, wherein a top surface of the planarization layer around the auxiliary layer is coplanar with a top surface of the layer structure after the chemical mechanical polishing process, wherein the chemical mechanical polishing process comprises a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer, and wherein the first removal rate is greater than the second removal rate; and selectively removing the auxiliary layer to form a substantially planar surface of remaining auxiliary layer or of the layer structure and the planarization layer.