| 发明名称 | Inductor for post passivation interconnect | ||
| 摘要 | An inductor device and method of forming the inductor device are provided. In some embodiments the inductor device includes a post passivation interconnect (PPI) layer disposed and an under bump metallization (UBM) layer, each disposed over a substrate. The PPI layer forms a coil and dummy pads. The dummy pads are disposed around a substantial portion of the coil to shield the coil from electromagnetic interference. A first portion of the UBM layer is electrically coupled to the coil and configured to interface with an electrical coupling member. | ||
| 申请公布号 | US9000876(B2) | 申请公布日期 | 2015.04.07 |
| 申请号 | US201213419272 | 申请日期 | 2012.03.13 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Tsai Hao-Yi;Chen Hsien-Wei;Kuo Hung-Yi;Chen Jie;Chen Ying-Ju;Yu Tsung-Yuan |
| 分类号 | H01F5/00;H01F27/28;H01F27/36;H01L31/107;H01L23/522;H01L23/552;H01L23/00;H01L49/02;H01L23/58 | 主分类号 | H01F5/00 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. An inductor device, comprising: a post passivation interconnect (PPI) layer disposed over a substrate, the PPI layer forming a coil and dummy pads, the dummy pads disposed around a substantial portion of the coil to shield the coil from electromagnetic interference; and an under bump metallization (UBM) layer disposed over the substrate, a first portion of the UBM layer electrically coupled to the coil and configured to interface with an electrical coupling member. | ||
| 地址 | Hsin-Chu TW | ||