Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound

摘要

An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.

主权项

1. An epoxy resin compound comprising:
an epoxy resin; a hardening agent; and an inorganic filler, wherein the epoxy resin comprises an epoxy resin represented by the following Chemical Formula 1: wherein n is from 1 to 3, m is from 1 to 3, R1 represents one to three aryl groups, R2 represents one to three aryl groups, and R3, R4, R5, R6, R7 and R8 are independently selected from the group consisting of hydrogen, an alkyl group having 1 to 30 carbon atoms, a halogen, an aryl group, an alkoxy group, an amino group, a hetero aryl group, and a carboxylic group, and wherein at least one of R7 and R8 is a halogen.