| 发明名称 | Fixing semiconductor die in dry and pressure supported assembly processes | ||
| 摘要 | Semiconductor die are assembled on a substrate by providing the semiconductor die, substrate, and an elastically deformable foil fixture preformed with one or more sunken regions having sidewalls and a bottom, and placing the semiconductor die in the one or more sunken regions so that the foil fixture is populated with a first side of the semiconductor die facing the bottom of the one or more sunken regions and a second opposing side of the semiconductor die facing away from the bottom of the one or more sunken regions. The substrate is placed adjacent the second side of the semiconductor die with a joining material interposed between the substrate and the semiconductor die. The substrate and the populated foil fixture are pressed together at an elevated temperature and pressure via first and second pressing tool members so that the substrate is attached to the second side of the semiconductor die via the joining material. | ||
| 申请公布号 | US8999758(B2) | 申请公布日期 | 2015.04.07 |
| 申请号 | US201113208893 | 申请日期 | 2011.08.12 |
| 申请人 | Infineon Technologies AG | 发明人 | Bayerer Reinhold |
| 分类号 | H01L21/00;H01L21/673;H01L21/67;H01L21/687;H01L23/00 | 主分类号 | H01L21/00 |
| 代理机构 | Murphy, Bilak & Homiller, PLLC | 代理人 | Murphy, Bilak & Homiller, PLLC |
| 主权项 | 1. A method of assembling semiconductor die on a substrate, comprising: providing a plurality of semiconductor die, a substrate, and an elastically deformable foil fixture preformed with one or more sunken regions having sidewalls and a bottom; placing the plurality of semiconductor die in the one or more sunken regions to populate the foil fixture, with a first side of the plurality of semiconductor die facing the bottom of the one or more sunken regions and a second opposing side of the plurality of semiconductor die facing away from the bottom of the one or more sunken regions; placing the substrate adjacent the second side of the plurality of semiconductor die with a joining material interposed between the substrate and the plurality of semiconductor die; and pressing together the substrate and the populated foil fixture at an elevated temperature and pressure via first and second pressing tool members so that the substrate is attached to the second side of the plurality of semiconductor die via the joining material, wherein end regions of the populated foil fixture form a seal between the first and second pressing tool members while the substrate and the populated foil fixture are pressed together at an elevated temperature and pressure. | ||
| 地址 | Neubiberg DE | ||