Method for fabricating thin touch sensor panels

摘要

A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.

主权项

1. A method for fabricating a thin printed circuit, comprising:
providing a first substrate having a first thickness, a first surface, and a second surface; providing a second substrate having a second thickness, a third surface, and a fourth surface; joining the first and second substrates together to form a first sandwich, the first surface of the first substrate being a first outer surface of the first sandwich and the third surface of the second substrate being a second outer surface of the first sandwich; forming thin film patterns on the first outer surface of the first sandwich; separating the first and second substrates of the first sandwich from each other; and joining the first substrate and the second substrate together to form a second sandwich, the second surface of the first substrate being an outer surface of the second sandwich, wherein the first substrate is a first glass sheet, and the second substrate is a carrier substrate.