发明名称 Fluid handling apparatus and fluid handling system
摘要 Bottomed first regions 23a′ and 23b′, and second regions 24a′ and 24b′ are formed by joining film 14 to undersurface 21 of chip body 12 of a micro-channel chip. Third regions 25a′ and 25b′ are formed between first regions 23a′ and 23b′, and second regions 24a′ and 24b′ so as to be located on carbon inks 16a and 16b. The width of third regions 25a′ and 25b′ is formed so as to be greater than the width of carbon inks 16a and 16b.
申请公布号 US8997787(B2) 申请公布日期 2015.04.07
申请号 US201213438261 申请日期 2012.04.03
申请人 Enplas Corporation 发明人 Nakao Tomoki;Ono Koichi
分类号 F15C1/06;G01N27/447;B01L3/00 主分类号 F15C1/06
代理机构 Brundidge & Stanger, P.C. 代理人 Brundidge & Stanger, P.C.
主权项 1. A fluid handling apparatus comprising: a substrate member; a cover member joined to one surface of the substrate member; and a transfer function section formed on the cover member for transferring electricity or heat, said transfer function section being formed in a laminar shape so as to cover a part of a surface of the cover member, wherein said substrate member includes a depression or a through hole constituting a first region formed in the one surface thereof at a portion corresponding to one end of the transfer function section, said cover member is disposed to close an opening of the depression or the through hole, said transfer function section includes the other end corresponding to a second region communicating with an outside, said transfer function section is disposed to electrically or thermally connect the first region and the second region, said substrate member further includes a groove constituting a third region formed in the one surface thereof so as to extend over an edge of the transfer function section extending between the first region and the second region, said cover member is disposed to cover an opening of the groove, and said transfer function section is exposed to the first region, the second region and the third region.
地址 Saitama JP
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