Package including an interposer having at least one topological feature

摘要

Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having an interposer including at least one topological feature, such as a depression in a surface of the interposer, a die coupled to the surface of the interposer, and an encapsulant material formed over the die and the interposer, and disposed in the at least one depression to resist movement of the encapsulant material relative to the interposer. Other embodiments may be described and claimed.

主权项

1. A method of manufacturing a semiconductor device package, the method comprising:
forming at least one depression in a top surface of an interposer, wherein the interposer includes a soldermask, and wherein forming the at least one depression includes forming an opening in a portion of the top surface located in a gap between first and second bond pads at the top surface and such that the opening extends from a surface of the soldermask to an underlying metal region of the interposer; coupling a die to the top surface of the interposer; and disposing an encapsulant over the die and the interposer, and such that the encapsulant is disposed within the at least one depression.