发明名称 Cooling mechanism
摘要 A cooling mechanism for cooling an object includes a duct that leads a fluid for cooling, multiple fans that are placed on a channel in the duct and send forth the fluid for cooling, and a bypass channel that detours at least one of the multiple fans.
申请公布号 US8998689(B2) 申请公布日期 2015.04.07
申请号 US200812036719 申请日期 2008.02.25
申请人 NEC Corporation 发明人 Mitsui Tomoyuki
分类号 H05K5/00;H01L23/467;H05K7/20;G06F1/20;H05K5/02 主分类号 H05K5/00
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A cooling mechanism for cooling an object, comprising: a duct that leads a fluid for cooling; multiple fans that are placed in the duct and send the fluid for cooling; and a bypass channel that detours at least one of the multiple fans, wherein: the duct is a first duct; the cooling mechanism further comprising a plurality of second ducts provided inside the first duct and the multiple fans wherein the second ducts are aligned coaxially, a first fan of one of the multiple fans provided outside the second ducts in the first duct; and a second fan of one of the multiple fans provided to each one of the second ducts, the bypass channel includes space outside the second duct and inside the first duct; and the cooling mechanism discharges the fluid for cooling supplied from an inlet side of the first duct via the bypass channel, wherein: the first duct includes a first space and a second space connected to the first space by an opening; the first space includes the first fan; the second space includes the second ducts; the first space is provided on the inlet side of the second space or the outlet side of the second space; the cooling mechanism includes a gap between the first space and at least one of the second fans; and the fluid for cooling is flowable into or out of the bypass channel via the gap.
地址 Tokyo JP