| 摘要 |
A heat sink assembly for LED lighting is disclosed. The heat sink assembly comprises a base unit disposed in contact with a heat source in order to conduct heat generated from the heat source; a shaft unit with one end thereof mounted in the middle of the base unit; a heat radiation unit having a plurality of heat radiation fins around the shaft unit to radiate the heat conducted and forming a flow path of air in an inside portion by constructing an outside portion thereof higher than the inside portion thereof; and a holder unit pressurizing the inside portion of the heat radiation unit by mounting the other end of the shaft unit on the holder unit and thereby positioning the combination of the heat radiation unit and the base unit at a lower end of the inside portion of the heat radiation unit. Accordingly, an oxidation film process such as anodizing may be performed, thereby lowering plating costs, and electrodeposition coating around joined positions is possible by avoiding joining methods such as welding and bonding when fixating the heat radiation fins. Also, additional structures can be installed in the heat sink assembly, thus, the heat dissipating structure can be expanded, and structures having additional functions such as a stabilizer or a case can be easily combined to the present invention. |
