发明名称 Optoelectronic component
摘要 An optoelectronic component has a semiconductor body including an epitaxial layer sequence, and a carrier substrate consisting of a semiconductor material connected to the semiconductor body by a solder layer, and through-connections. The carrier substrate includes a surface doping zone extending along a first main surface facing the semiconductor body. The surface doping zone includes a p-conductive region and an n-conductive region adjacent thereto, between which regions a pn-junction is formed. The n-conductive region electrically connects to a p-doped region of the epitaxial layer sequence via a first sub-region of the solder layer, and the p-conductive region electrically connects to an n-doped region of the epitaxial layer sequence via a second sub-region of the solder layer.
申请公布号 US9000476(B2) 申请公布日期 2015.04.07
申请号 US201113810335 申请日期 2011.05.25
申请人 OSRAM Opto Semiconductors GmbH 发明人 Höppel Lutz
分类号 H01L33/00;H01L33/62;H01L25/16;H01L33/22;H01L33/38 主分类号 H01L33/00
代理机构 DLA Piper LLP (US) 代理人 DLA Piper LLP (US)
主权项 1. An optoelectronic component having a semiconductor body comprising an epitaxial layer sequence having an active layer that generates radiation, and a carrier substrate consisting of a semiconductor material connected to the semiconductor body by a solder layer, wherein the carrier substrate comprises a first through-connection and a second through-connection each of which extend from a first main surface of the carrier substrate facing the semiconductor body to a second main surface of the carrier substrate facing away from the semiconductor body, the epitaxial layer sequence comprises a p-doped semiconductor region and an n-doped semiconductor region, wherein the first through-connection connects in an electrically conductive manner to the p-doped semiconductor region via a first sub-region of the solder layer, and the second through-connection connects in an electrically conductive manner to the n-doped semiconductor region via a second sub-region of the solder layer, the carrier substrate comprises a surface doping zone which extends along the first main surface, the surface doping zone comprises a p-conductive region which contains a p-dopant, the surface doping zone comprises an n-conductive region adjacent to the p-conductive region and contains an n-dopant and a p-dopant so that a pn-junction is formed between the p-conductive region and the n-conductive region, the n-conductive region electrically connects to the first sub-region of the solder layer and the p-conductive region electrically connects to the second sub-region of the solder layer so that the pn-junction in the surface doping zone forms a protective diode for the semiconductor body, the p-conductive region contains a p+-conductive region having a higher concentration of p-dopant than a remaining p-conductive region, and the p+-conductive region is disposed as a ring around the first through-connection.
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