| 摘要 |
<p>The present disclosure relates to a semiconductor device comprising a heat dissipating structure. The semiconductor device may include at least one semiconductor element and a heat dissipating structure which is formed on at least one side of the semiconductor element and is electrically connected to the semiconductor device. The heat dissipating structure can supply power to the semiconductor element. An insulating layer can be formed on the surface of the heat dissipating structure.</p> |
