| 摘要 |
PROBLEM TO BE SOLVED: To provide a soft polishing pad for polishing a semiconductor substrate.SOLUTION: In the specification, a soft polishing pad for polishing a semiconductor substrate is described. The soft polishing pad includes a homogeneous polishing body which includes a thermosetting closed-cell polyurethane material having shore D hardness in a range of approximately 20 to 45 and is molded. In one embodiment, the molded homogeneous polishing body includes a first grooved surface and a second flat surface which is opposite to the first surface. In one embodiment, the soft polishing pad further includes a local transparent (LAT) area disposed in the molded homogeneous polishing body. The LAT area is covalently-bonded to the molded homogeneous polishing body. |
