SURFACE-TREATED COPPER FOIL AND LAMINATED BOARD, PRINTED WIRING BOARD AND ELECTRONIC DEVICE USING SAME, AS WELL AS METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a surface-treated copper foil which adheres suitably to a resin, is excellent in transparency of a resin after removing the copper foil by etching and has less transmission loss of signal and to provide a laminated board using the same.SOLUTION: There is provided a surface-treated copper foil in which the root mean square height Rq of a surface-treated surface S is 0.14 to 0.63μm, wherein in the observation point-brightness graph, the difference between the top average value Bt and the bottom average value Bb of the brightness curve produced from the end of a mark to a portion where the mark is not drawn is represented byΔB=Bt-Bb, a value indicating the position of the intersection point closest to the linear mark among the intersection points of the brightness curve with Bt is defined as t1 and a value indicating the intersection point closest to the linear mark among the intersection points of the brightness curve with 0.1ΔB in the depth range to 0.1ΔB with reference to Bt from the intersection point of the brightness curve with Bt is defined as t2, Sv defined by the following expression (1) is 3.5 or more. Sv=(ΔB×0.1)/(t1-t2) (1)