HEAT-CONDUCTIVE ADHESIVE SHEET, MANUFACTURING METHOD FOR SAME, AND ELECTRONIC DEVICE USING SAME

摘要

The purpose of the present invention is to provide: a heat-conductive adhesive sheet which is stacked in an electronic device so as to efficiently radiate heat, and which can selectively radiate heat in a specific direction, as well as impart a sufficient temperature difference to the interior of the electronic device; a manufacturing method for the same; and an electronic device using the same. The heat-conductive adhesive sheet comprises an adhesive layer and a substrate comprising a high heat conductivity part and a low heat conductivity part, the adhesive layer is stacked on one surface of the substrate, while the other surface of the substrate is constituted by both the surface of the low heat conductivity part on the opposite side of the surface thereof in contact with the adhesive layer and the surface of the high heat conductivity part on the opposite side of the surface thereof in contact with the adhesive layer, or the high heat conductivity part and/or the low heat conductivity part constitute a portion of the thickness of the substrate. A manufacturing method for the heat-conductive adhesive sheet and an electronic device using the heat-conductive adhesive sheet are also provided.