THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-LIKE ARTICLE, METHOD FOR PRODUCING SAME, AND ELECTRONIC EQUIPMENT

摘要

A polymerization reaction of at least a (meth)acrylic ester monomer (α1) is carried out in a mixed composition which comprises 100 parts by mass of a (meth)acrylic resin composition (A) which includes a (meth) acrylic ester polymer (A1) and the (meth)acrylic ester monomer (α1), 250 to 1300 parts by mass of a thermally conductive filler (B), and 0.05 to 6 parts by mass of a silane coupling agent (C). Thereby, a thermally conductive pressure-sensitive adhesive composition and a thermally conductive pressure-sensitive adhesive sheet-like article are provided which have excellent flexibility and good external appearance while having an increased amount of an additive that improves thermal conductivity.