METHOD FOR PREPARING DRY FILM SOLDER RESIST, AND FILM LAMINATE USED THEREIN

摘要

The present invention relates to: a method for preparing a dry film solder resist capable of allowing a dry film solder resist, having surface micro protrusions, to be formed by a more simplified method; and a film laminate used therein. The method for preparing a dry film solder resist comprises the steps of: forming a predetermined photocurable and thermosetting resin composition on a transparent carrier film having surface micro protrusions with an average roughness (Ra) of 200 nm to 2μm; forming a layered structure in which a substrate, the resin composition and the transparent carrier film are sequentially formed by layering the resin composition on the substrate; exposing the resin composition and stripping the transparent carrier film; and alkali developing the resin composition of an unexposed portion and thermally curing the same.