发明名称 Thermal Management for Light Emitting Diode Fixture
摘要 A recessed light fixture includes an LED module, which includes a single LED package that is configured to generate all light emitted by the recessed light fixture. For example, the LED package can include multiple LEDs mounted to a common substrate. The LED package can be coupled to a heat sink for dissipating heat from the LEDs. The heat sink can include a core member. A reflector housing may be coupled to the heat sink and configured to receive a reflector. The reflector can have any geometry, such as a bell-shaped geometry including two radii of curvature that join together at an inflection point. An optic coupler can be coupled to the reflector housing and configured to cover electrical connections at the substrate and to guide light emitted by the LED package.
申请公布号 US2015092425(A1) 申请公布日期 2015.04.02
申请号 US201414563551 申请日期 2014.12.08
申请人 Cooper Technologies Company 发明人 Thompson, III Evans Edward;Tickner Jerry Alan
分类号 F21V29/00;F21S8/02 主分类号 F21V29/00
代理机构 代理人
主权项 1. A light emitting diode (“LED”) downlight module, comprising: a heat sink comprising a heat sink bottom surface; an LED light source coupled to the heat sink; a housing comprising a sidewall surrounding a channel formed therein, the housing being coupled to the heat sink bottom surface, wherein light emitted from the LED light source is emitted through the channel; and a trim removably coupled to a lower portion of the housing, the trim being replaceable.
地址 Houston TX US