| 发明名称 |
PACKAGE CARRIER |
| 摘要 |
A package carrier including a removable supporting plate and a circuit board is provided. The removable supporting plate includes a dielectric layer, a copper foil layer and a releasing layer. The dielectric layer is disposed between the copper foil layer and the releasing layer. The circuit board is disposed on the removable supporting plate and directly contacts the releasing layer. A thickness of the circuit board is between 30 μm and 100 μm. |
| 申请公布号 |
US2015092358(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
US201314072803 |
申请日期 |
2013.11.06 |
| 申请人 |
Wang Chin-Sheng;Chen Ching-Sheng;Wang Chao-Min |
发明人 |
Wang Chin-Sheng;Chen Ching-Sheng;Wang Chao-Min |
| 分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package barrier, comprising:
a removable supporting plate comprising a dielectric layer, a copper foil layer and a releasing layer, wherein the dielectric layer is disposed between the copper foil layer and the releasing layer; and a circuit board disposed on the removable supporting plate and directly contacting the releasing layer, wherein a thickness of the circuit board is between 30 μm to 100 μm. |
| 地址 |
Hsinchu County TW |
