| 发明名称 |
Explosion-Protected Semiconductor Module |
| 摘要 |
A semiconductor module has a carrier, a semiconductor chip mounted on the carrier, a bond wire, a module housing, and a first sound absorber. The module housing has a housing side wall. The bond wire is arranged in the module housing. At least a section of the first sound absorber is arranged between the semiconductor chip and the housing side wall. |
| 申请公布号 |
US2015091148(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
US201414499737 |
申请日期 |
2014.09.29 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Boenig Guido;Hohlfeld Olaf |
| 分类号 |
H01L23/00;H01L23/24 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor module, comprising:
a carrier; a semiconductor chip mounted on the carrier; a bond wire; a module housing; and a first sound absorber, wherein the module housing has a housing side wall, wherein the bond wire is arranged in the module housing, wherein at least a section of the first sound absorber is arranged between the semiconductor chip and the housing side wall. |
| 地址 |
Neubiberg DE |
