DEVICE FOR ALIGNING AND PRE-FIXING A WAFER

摘要

A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

主权项

1. Device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate, the device including:
at least one aligning actuator having a single actuator arm, the single actuator arm oriented toward a center of the carrier substrate wherein the single actuator arm engages an outside contour of the flat substrate and/or an outside contour of the carrier substrate to move the flat substrate and/or the carrier substrate along a plane parallel to a contact surface of the flat substrate; and at least one attaching actuator engaging the flat substrate and/or the carrier substrate to at least partially prefix the flat substrate and the carrier substrate together.