| 摘要 |
The present invention provides a thermosetting resin composition, a prepreg comprising the composition, and a copper-clad laminate, the thermosetting resin composition comprising: (a) a modified polyphenylene oxide resin which is redistributed in the presence of a bisphenol compound (except for bisphenol A) and a radical initiator, so that the weight-average molecular weight (Mw) is modified to a low molecular weight range of 1,000 to 20,000, and which has at least two functional groups selected from a group consisting of a hydroxy group and a vinyl group, at both ends of a molecular chain; and (b) a crosslinkable curing agent. The present invention can provide a printed circuit board for high frequency simultaneously exhibiting excellent low dielectric loss characteristics as well as excellent processability, copper foil adhesive property, thermal stability, etc. |
