Semiconductor Module Comprising Printed Circuit Board and Method for Producing a Semiconductor Module Comprising a Printed Circuit Board

摘要

A semiconductor module includes a printed circuit board, a ceramic substrate and a semiconductor chip. The printed circuit board includes an insulating material, a cutout formed in the insulating material, and a first metallization layer, which is partly embedded into the insulating material. The first metallization layer includes a conductor track projection projecting into the cutout. The ceramic substrate includes a dielectric, ceramic insulation carrier, and an upper substrate metallization applied to a top side of the insulation carrier. The semiconductor chip is arranged on the upper substrate metallization, and the first metallization layer is mechanically and electrically conductively connected to the upper substrate metallization at the conductor track projection.

主权项

1. A semiconductor module, comprising:
a printed circuit board comprising an insulating material, a cutout formed in the insulating material, and a first metallization layer, which is partly embedded into the insulating material and which has a conductor track projection projecting into the cutout; a ceramic substrate comprising a dielectric, ceramic insulation carrier, and an upper substrate metallization, which is applied to a top side of the insulation carrier; and a semiconductor chip arranged on the upper substrate metallization, wherein the first metallization layer is mechanically and electrically conductively connected to the upper substrate metallization at the conductor track projection.