| 发明名称 |
HEAT-CONDUCTIVE CONNECTION ARRANGEMENT |
| 摘要 |
A heat-conductive connection arrangement for connecting a printed circuit board to a cooling body. The connection arrangement has a carrier which is flat. At least part of the carrier includes at least one balloon body which faces away from the carrier and is connected to the carrier. The balloon body includes an envelope which encloses an interior, and the interior is at least in part filled with a preferably free-flowing, in particular viscous, heat-conducting substance. The envelope is configured so as to tear open under the influence of pressure and to thus release the heat-conducting substance. |
| 申请公布号 |
US2015092350(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
US201414501273 |
申请日期 |
2014.09.30 |
| 申请人 |
Robert Bosch GmbH |
发明人 |
Mayer Frank;Jerg Juergen |
| 分类号 |
H05K7/20;F28F13/00;F28F21/00;H05K1/02 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat-conductive connection means (30, 31) for connecting a printed circuit board (3) to a cooling body (5), having a carrier (7) which is configured so as to be flat, wherein at least part of the carrier (7) includes at least one balloon body (8, 12) which faces away from the carrier (7) and is connected to the carrier (7), wherein the balloon body (8, 12) includes an envelope (9) which encloses an interior, wherein the interior is at least in part filled with a viscous heat-conducting means (10) and the envelope (9) is configured so as to tear open under the influence of pressure and to thus release the heat-conducting means (10). |
| 地址 |
Stuttgart DE |
