MOLD LOCKS FOR LAMINATE SUBSTRATES

摘要

A mechanism is provided by which delamination of a substrate of a system-in-package is prevented. A mold lock feature is provided within the substrate that allows the mold compound forming the encapsulant to flow into the mold lock feature, thereby anchoring the encapsulant to the substrate. The mold lock features can be provided in areas of the substrate where higher stresses due to component configuration are predicted. Aspects of the present invention provide for a method of forming the mold lock features that is compatible with current methods of forming laminate substrates, and thereby do not require an increase in cost for manufacturing the substrate.

主权项

1. A semiconductor device package comprising:
a substrate comprising
a first layer having a first opening formed with a first opening area,a second layer having a second opening formed with a second opening area,
whereinthe second opening area is less than the first opening area,the second layer is provided above the first layer in a laminate stack forming the substrate,the second opening is located in a position that provides access to the first opening from a major surface of the substrate, anda third layer provided below the first layer in the laminate stack forming the substrate and covering the side of the first opening opposite the second layer; and encapsulant formed over the major surface of the substrate and within the first and second openings.