PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

The present disclosure provides a package structure and a manufacturing method. The package structure includes a substrate, a cover, a conductive pattern, and a sensing component. The cover is disposed on the substrate. The cover and the substrate define an accommodation space. The conductive pattern includes a conductive line. The conductive line is disposed on an internal surface of the cover exposed by the accommodation space, and is electrically connected to the substrate. The sensing component is disposed on the internal surface of the cover, and is electrically connected to the conductive line.

主权项

1. A package structure, comprising:
a substrate; a cover disposed on the substrate, the cover and the substrate defining an accommodation space; a conductive pattern comprising a conductive line, the conductive line disposed on an internal surface of the cover facing the accommodation space, and electrically connected to the substrate; and a sensing component disposed on the internal surface of the cover, and electrically connected to the conductive line.