发明名称 |
PHASE CHANGE MEMORY AND FABRICATION METHOD |
摘要 |
A phase change memory and its fabrication method are provided. A bottom electrode structure is provided through a substrate. A mask layer is formed on the substrate and the bottom electrode structure. A first opening is formed in the mask layer to expose the bottom electrode structure. A spacer is formed on sidewalls and bottom surface portions of the first opening to expose a surface portion of the bottom electrode structure. The first opening including the spacer therein has a bottom width less than a top width. A heating layer is formed at least on the surface portion of the bottom electrode structure exposed by the spacer. A phase change layer is formed on the heating layer to completely fill the first opening. A top electrode is formed on the phase change layer and the mask layer. |
申请公布号 |
US2015090954(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
US201414494321 |
申请日期 |
2014.09.23 |
申请人 |
Semiconductor Manufacturing International (Shanghai) Corporation ;Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science |
发明人 |
LI YING |
分类号 |
H01L45/00 |
主分类号 |
H01L45/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method for fabricating a phase change memory, comprising:
providing a substrate containing a bottom electrode structure through the substrate, the bottom electrode structure having a top surface flushed with a top surface of the substrate; forming a mask layer on the flushed top surfaces of the substrate and the bottom electrode structure; forming a first opening in the mask layer to expose the top surface of the bottom electrode structure; forming a spacer on sidewalls and bottom surface portions of the first opening to expose a surface portion of the bottom electrode structure, wherein the first opening including the spacer therein has a width at a bottom of the first opening less than a width at a top of the first opening; forming a heating layer at least on the surface portion of the bottom electrode structure exposed by the spacer, the heating layer having a top surface lower than a top surface of the mask layer; forming a phase change layer on the heating layer to completely fill the first opening; and forming a top electrode on the phase change layer and the mask layer. |
地址 |
Shanghai CN |