SUCTION STAGE, BONDING DEVICE, AND METHOD FOR MANUFACTURING BONDED SUBSTRATE

摘要

A suction stage according to an embodiment is provided with a mounting unit on which a first substrate is mounted, and an evacuation unit which evacuates a space between the first substrate and the mounting unit. The mounting unit comprises a first wall part provided on the outer edge side of one end face of the mounting unit and having a ring shape, and a second wall part provided inside the first wall part and having a ring shape. The evacuation unit comprises a first control valve provided between a first region between the first wall part and the second wall part and the evacuation unit, a second control valve provided between a second region inside the second wall part and the evacuation unit, and a control unit for controlling the first control valve and the second control valve. The control unit controls the first control valve and the second control valve to thereby alternately perform the suction of the first substrate and the release of the suction of the first substrate in the first region and/or the second region. While releasing the suction of the first substrate in either one of the first region and the second region, the control unit performs the suction of the first substrate in the other region.