发明名称 |
STIFFENER WITH EMBEDDED PASSIVE COMPONENTS |
摘要 |
<p>Systems and methods for preventing warpage of a semiconductor substrate in a semiconductor package (200). A continuous or uninterrupted stiffener structure (208) is designed with a recessed groove (208b), such that passive components, such as, high density capacitors are housed within the recessed groove. The stiffener structure with the recessed groove is attached to the semiconductor substrate (202) using anisotropic conductive film (ACF) or anisotropic conductive paste (ACP). The stiffener structure with the recessed groove surrounds one or more semiconductor devices (204) that may be formed on the semiconductor substrate. The stiffener structure with the recessed groove does not extend beyond horizontal boundaries of the semiconductor substrate.</p> |
申请公布号 |
WO2015048368(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
WO2014US57584 |
申请日期 |
2014.09.26 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
KIM, DONG WOOK;HWANG, KYU-PYUNG;SONG, YOUNG KYU;YUN, CHANGHAN HOBIE |
分类号 |
H01L23/16;H01L23/00 |
主分类号 |
H01L23/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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