| 摘要 |
<p>An apparatus for polishing wafer is provided. An embodiment includes a plate of which surface has multiple grooves of concentric-circle shape; multiple carriers which are arranged on the plate and arranges a wafer; a polishing head which corresponds to the carriers, respectively, and pressurizes the carriers, and polishes the wafer; and a plate cleaner. Multiple protrusions of the plate cleaner correspond to the grooves.</p> |
