| 发明名称 |
Waterborne adhesives for reduced basis weight multilayer substrates and use thereof |
| 摘要 |
The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates. |
| 申请公布号 |
AU2013324229(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
AU20130324229 |
申请日期 |
2013.08.16 |
| 申请人 |
HENKEL IP & HOLDING GMBH |
发明人 |
HUANG, TIANJIAN;THOMPSON, KRISTINA;WASKI, DANIEL;MECCIA, JOHN |
| 分类号 |
D21H27/30;D21H27/32;D21H27/36;D21H27/40 |
主分类号 |
D21H27/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
